Machine Features: 
1.Using QCW fiber laser.
2.Dedicated beam transmission system.
3.High-accuracy linear motor working platform with high precision and fast speed.
4.Automatic CCD positioning and calibration.
5.Non-contact processing without mechanical stress or deformation.
This machine is used for drilling and scribing on ceramic plate, precision cutting and shaping of ceramic circuit board. It is applicable to alumina ceramic, zirconia ceramic and AlN ceramic substrate, especially DPC, COB substrate cutting, drilling and scribing, and sputtered, electroplated and printed substrate cutting and routing.